Fungus Test for Jackets

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Table 508.6-I. US Test fungus

Table 508.6-II. Evaluation scheme for visible effects.1/

Table 508.6B-I. Fungi susceptibility of materials.

# The fungus test must be needed before installing cables or wires at long-running facilities or factories. If the fungus grows, the corona creepage or discharge should be occurred.
# This DATA is from MIL-STD-810G, METHOD 508.6.

Fungus Fungus Sources
Identification No.1(USDA2/)
Fungus Sources
Identification No.1(ATCC3/)
Materials Affected
Aspergillus flavus QM 380 ATCC 9643 Leathers, textiles, rubber. Electrical insulation, varnish, wax, packing materials, etc.
Aspergillus versicolor QM 432 ATCC 11730 Leather, adhesives, textiles, automotive components such as gaskets, distributors, cables, hoses, PVC, breakers, solenoids, switches
Penicillium funiculosum QM 474 ATCC 11797 Textiles, plastics, cotton fabric, polymers, automotive components such as gaskets, distributors, cables, hoses, PVC, airborne equipment such as breakers, solenoids, switches, remote transmission accessories
Chaetomium globosum QM 459 ATCC 6205 Cellulose and any components containing paper and paper products such as packing materials, textiles,
polymeric hydrocarbons and some synthetic polymeric materials
Aspergillus niger QM 386 ATCC 9642 Textiles, vinyl, conformal coatings, insulation, leather, etc.; resistant to tanning salts

# The fungus test must be needed before installing cables or wires at long-running facilities or factories. If the fungus grows, the corona creepage or discharge should be occurred.
# This DATA is from MIL-STD-810G, METHOD 508.6.

Amount of Growth Rating Comments
None 0 Substrate is devoid of microbial growth.
Trace 1 Scattered, sparse or very restricted microbial growth.
Light 2 Intermittent infestations or loosely spread microbial colonies on substrate surface. Includes continuous filamentous growth extending over the entire surface, but underlying surfaces are still visible.
Medium 3 Substantial amount of microbial growth. Substrate may exhibit visible
structural change.
Heavy 4 Massive microbial growth.

1/ Use this scheme as a guide, but exceptions may occur that require a more specific description.

# The fungus test must be needed before installing cables or wires at long-running facilities or factories. If the fungus grows, the corona creepage or discharge should be occurred.
# This DATA is from MIL-STD-810G, METHOD 508.6.

Group I – Fungus-inert materials
(Fungus-inert in all modified states and grades)
Acrylics
Acrylonitrile-styrene
Acrylonitrile-vinyl-chloride copolymer
Asbestos
Ceramics
Chlorinated polyester
Flourinated ethylenepropylene copolymer (FEP)
Glass
Metals
Mica
Plastic laminates:
Silicone-glass fiber
Phenolic-nylon fiber
Diallyl phthalate
Polyacrylonitrile
Polyamide
Polycarbonate
Polyester-glass fiber laminates
Polyethylene, high density (above 0.940)
Polyethylene terephthalate
Polyimide
Polymonochlorotrifluoroethylene
Polyporpylene
Polystyrene
Polysulfone
Polytetrafluoroethylene
Polyvinylidene Chloride
Silicone resin
Siloxane-polyolefin polymer
Siloxane polystyrene

 

Group II – Fungus nutrient materials
(May require treatment to attain fungus resistance)
ABS (acrylonitrile-butadiene-styrene)
Acetal resins
Cellulose acetate
Cellulose acetate butyrate
Epoxy-glass fiber laminates
Epoxy-resin
Lubricants
Melamine-formaldehyde
Organic polysulphides
Phenol-formaldehyde
Polydichlorostyrene
Polyethylene, low & medium density (0.940 and below)
Polymethyl methacrylate
Polyurethane (ester types are particularly susceptible)
Polyricinoleates
Polyvinyl chloride
Polyvinyl chloride-acetate
Polyvinyl fluoride
Rubber, natural and synthetic
Urea-formaldehyde